Abstract: With the improvement of automobile intelligence, the number of controlled hardwares for intelligent cockpit domain controllers is increasing, which requires chips with higher power and load, resulting in higher requirements of chip heat dissipation. In order to solve the problem of chip heat dissipation, an intelligent cockpit domain controller based on liquid cooling heat dissipation is designed, which includes two control boards of system on chip (SoC) and gateway control boards. By setting a liquid cooling cooling device on the upper cover that is in contact with the SoC chip, the SoC chip with high heat dissipation demand due to high calculation load and power can get rapid heat dissipation. The lower cover is set with zigzag stripes to increase the heat dissipation area for the gateway board control card heat dissipation. The flow velocity distribution, pressure distribution and temperature distribution of liquid cooling are studied by thermal simulation. The results of thermal simulation and measured data show that under the condition of water cooling cycle, the temperature of each chip under stable operation is much lower than its node temperature, and the heat dissipation effect is good.

Key words: intelligent cockpit domain controller; liquid cooled heat dissipation; dual control board; thermal simulation

摘要： 随着汽车智能化程度的提高，智能座舱域控制器所需控制的硬件数量越来越多，需要 芯片具有更高的功率和负荷，从而导致对芯片的散热要求更高。为了解决芯片散热问题，设 计了一种基于液冷散热的智能座舱域控制器，包含系统级（SoC）芯片板和网关板两块控制卡。 通过在和 SoC 芯片接触的上盖上设置液冷散热装置，使因计算负荷和功率较高而导致散热需 求较大的 SoC 芯片可以得到快速散热，在下盖设置锯齿状条纹增大散热面积用于网关板控制 卡散热，并研究了两块控制卡的散热路径。通过热仿真研究了液冷散热的流速分布、压力分 布和温度分布，热仿真和实测数据结果表明，在水冷循环条件下，各芯片稳定工作时的温度 远低于其结点温度，散热效果良好。

关键词: 智能座舱域控制器；液冷散热；双控制卡；热仿真