Abstract: In the semiconductor manufacturing process, the packaging process requires nitrogen filling and vacuuming of automotive silicon wafers. This process is very important for the transportation and preservation of automotive silicon wafers. This paper mainly studies the degree of contamination of automotive silicon wafers by the packaging process, the impact on the process and the methods to reduce this impact. Due to the requirements of stability, non-polluting and anti-oxidation in the packaging process, it is necessary to carry out the process steps of nitrogen filling and vacuum suction on the automotive silicon wafer box containing the automotive silicon wafer, so as to remove the water vapor in the automotive silicon wafer box and oxygen is eliminated, and at the same time, the car silicon wafer box is filled with dry nitrogen, so as to avoid the formation of oxides on the surface of the car silicon wafer and improve the yield of the car silicon wafer. The reasons for the excessive particle pollution of automotive silicon wafers caused by the packaging process are analyzed, and by optimizing the packaging equipment and process flow of automotive silicon wafers, the impact of packaging processes on the particle pollution of automotive silicon wafers is effectively reduced.

Key words: Automotive silicon wafers; Packaging link; Particle pollution; Packaging device

摘要： 半导体制造过程中，封装工艺需要对汽车硅片进行充氮和真空处理。这一过程，对于 汽车硅片的运输和保存相当重要。文章主要研究封装工艺对汽车硅片颗粒污染的程度，对工 艺制程的影响以及降低这种影响的方法。封装工艺由于稳定性、无污染性和防氧化性等要求， 需要对装有汽车硅片的汽车硅片盒进行充氮和吸真空的工艺步骤，以此来将汽车硅片盒内的 水汽和氧气排除。同时使汽车硅片盒内充满干燥的氮气，避免汽车硅片表面生成氧化物，提 高汽车硅片的良品率。对于封装环节对汽车硅片造成颗粒污染超标的原因进行了分析，并通 过优化汽车硅片封装装置和工艺流程，有效地降低了封装环节对汽车硅片颗粒污染的影响。

关键词: 汽车硅片；封装环节；颗粒污染；封装装置