Abstract: The thesis introduces a semiconductor wafer polishing technology and semiconductor polishing technology route, briefly introduces the semiconductor polishing technology route and specific implementation plan, and the precise control of the pressure during the polishing process, the centering of the upper plate, and the control principle of the hydrostatic spindle the key technologies and their main components such as thickness measurement, grinding disc correction, etc., are introduced emphatically. Looking forward to the future development trend of semiconductor grinding technology with high precision, high stability, high automation and large size, it points out the necessity and significant advantages of semiconductor grinding and grinding technology.

Key words: Semiconductor; Grind; Grinding machine

摘要： 文章介绍了一种半导体硅片研磨技术和半导体研磨技术的路线，对半导体研磨技术路线和 具体实施方案做了简单介绍，对研磨过程中压力的精确控制、上盘调心、静压主轴控制原理、厚 度测量、研磨盘修正等关键技术及其主要零部件做了重点介绍。并展望半导体研磨技术高精度、 高稳定性、高自动化和大尺寸的未来发展趋势，指出半导体研磨磨削工艺的必要性和显著优势。

关键词: 半导体；研磨；研磨技术