关键词: 汽车硅片；封装环节；颗粒污染；封装装置

Abstract: In the semiconductor manufacturing process, the packaging process requires nitrogen filling and vacuuming of automotive silicon wafers. This process is very important for the transportation and preservation of automotive silicon wafers. This paper mainly studies the degree of contamination of automotive silicon wafers by the packaging process, the impact on the process and the methods to reduce this impact. Due to the requirements of stability, non-polluting and anti-oxidation in the packaging process, it is necessary to carry out the process steps of nitrogen filling and vacuum suction on the automotive silicon wafer box containing the automotive silicon wafer, so as to remove the water vapor in the automotive silicon wafer box and oxygen is eliminated, and at the same time, the car silicon wafer box is filled with dry nitrogen, so as to avoid the formation of oxides on the surface of the car silicon wafer and improve the yield of the car silicon wafer. The reasons for the excessive particle pollution of automotive silicon wafers caused by the packaging process are analyzed, and by optimizing the packaging equipment and process flow of automotive silicon wafers, the impact of packaging processes on the particle pollution of automotive silicon wafers is effectively reduced.

Key words: Automotive silicon wafers; Packaging link; Particle pollution; Packaging device