关键词: 智能座舱域控制器；液冷散热；双控制卡；热仿真

Abstract: With the improvement of automobile intelligence, the number of controlled hardwares for intelligent cockpit domain controllers is increasing, which requires chips with higher power and load, resulting in higher requirements of chip heat dissipation. In order to solve the problem of chip heat dissipation, an intelligent cockpit domain controller based on liquid cooling heat dissipation is designed, which includes two control boards of system on chip (SoC) and gateway control boards. By setting a liquid cooling cooling device on the upper cover that is in contact with the SoC chip, the SoC chip with high heat dissipation demand due to high calculation load and power can get rapid heat dissipation. The lower cover is set with zigzag stripes to increase the heat dissipation area for the gateway board control card heat dissipation. The flow velocity distribution, pressure distribution and temperature distribution of liquid cooling are studied by thermal simulation. The results of thermal simulation and measured data show that under the condition of water cooling cycle, the temperature of each chip under stable operation is much lower than its node temperature, and the heat dissipation effect is good.

Key words: intelligent cockpit domain controller; liquid cooled heat dissipation; dual control board; thermal simulation